Footprints made by Fped
adam at sharism.cc
Mon Jul 2 05:53:45 EDT 2012
About these footprints made by Fped, can be used in KiCad. So we collected
footprints under KiCad Libraries, still some few footprints from else
projects have not been added.
Most of them are for M1r4, few are for other projects.
Before editing, normally reference to module's datasheet to find info of
'package drawing' and 'land pattern'.
A good chip maker supposedly provides both of them. But practically it's
not in usual.
Another IPC standard 7351 is thorough document to know Generic Requirements
for Surface Mount Design and Land Pattern Standard.
It's a very good guideline and info to completely build generic
gullwing leaded components, two sides
J-Leaded components, two sides
gullwing leaded components, four sides
J-Leaded components, four sides
Post (DIP) leads, two sides
Area Array components (BGA, FBGA, CGA)
no lead components (QFN, SON, LCC))
so a research work indeed needed but take times.
If you are lucky, maker did all details for you. While editing 'c-t-smd'
packages for Chip SMD Tantalum Capacitors, KEMET lists directly dimensions
for three levels of density, so I named variants with
Case is as capacitor type, EIA is its standard size, Density is for density
level from IPC. Then a work in Fped GUI is easy.
If not, editing package work is more likely a follow-up with datasheet.
Even it's not enough to know if completely met with IPC.
At least component maker will show up which standard they follows and
usually set dimensions in as "Density Level B: Median (Nominal) Land
Means that there's a lot of improvements could be studied in the future
once you use for your need.
Btw, it's a start.
The lists of file name(*.fpd) below are shown:
>> only for 484 pins
>> Chip SMD Aluminum Electrolytic Capacitors
>> Chip SMD Tantalum Capacitors
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