solder paste vs. through-hole ?
werner at almesberger.net
Sun Jul 15 08:42:33 EDT 2012
Richard Ch?vez wrote:
> The reason of this is that the solder paste would end up filling the holes
> after reflow making it difficult to place the THT components
So it happens in real life. This would indeed be a killer.
How about chemically unstable surface finishes, like OSP ?
Is the degradation of the finish an issue in cases where
you combine SMT with a later TH pass ? If yes, would you
consider taking your chances with solder paste in this
case ? Or is OSP simply incompatible with a mixed SMT+TH
process and nobody in their right mind would try such a
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